General Semiconductor Inc

February 8, 2017
VideoCipher Division[edit]

1960: Semiconductor Components Division of General Instrument is founded in Hicksville, New York.

1964: General Instrument Taiwan factory is granted foreign license #1.

1976: Semiconductor Components assumes the name of Discrete Semiconductor.

1988: Discrete Semiconductor changes its name to Power Semiconductor Division.

1990: Forstmann Little acquires General Instrument Corp.

1992: General Instrument purchases GSI Ireland.

1995: General Instrument China license granted.

1997: General Instrument announces the split of its three divisions.

1997: General Semiconductor signs contract to acquire discrete business of ITT Industries, Inc.

1997: General Semiconductor becomes a publicly traded company NYSE: SEM (formerly the Power Semiconductor Division of General Instrument).

1997: General Semiconductor completes acquisition of Small Signal Business of ITT Industries, Inc.

2001: General Semiconductor is acquired by Vishay Intertechnology.

2001: General Semiconductor Inc. becomes Power Diodes Division (PDD) after being acquired by Vishay.

2001: Diodes and Transistors portion of Vishay Semiconductor GmbH (part of Vishay since its 1998 acquisition of TEMIC Semiconductor GmbH) becomes the Small-Signal Products (SSP) Division.

2001: SMF (DO-219AB) package platform, with a full range of Zener, switching diode, and ESD products, is released to the market.

2001: FSMC, the first Folded SMX product, is released to market.

2002: FSMA, the 2nd Folded SMX product, is released to market.

2002: Transzorb TVS products are released from Taipei, Taiwan factory.

2002: PDD starts to work with leading-edge foundry on Trench MOS Barrier Schottky (TMBS®) development.

2002: Patent (US 6, 393, 090) is granted for TMBS termination structure, followed by US 6, 420, 768 for further enhancement.

2003: FSMB, the 3rd Folded SMX product, is released to market.

2004: First leadless package (LLP) diodes, the LLP70 and LLP75, are introduced.

2004: The patent US 6, 791, 172 "Power Semiconductor Device Manufactured Using a Chip-Size Package" is granted for the eSMP® package.

2005: First TMBS product is released to market.

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